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3 notice for taiyo yuden products y please read this notice before using the taiyo yuden products. ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. 1 information on the general catalog reminders product information in this catalog is as of october 2008 . all of the contents specified herein are subject to change without notice due to technical improvements, etc. therefore, please check for the latest information carefully before practical application or usage of the products. please note that taiyo yuden co., ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those speci?ed in this catalog or individual speci?cation. please contact taiyo yuden co., ltd. for further details of product specifications as the individual speci?cation is available. please conduct validation and veri?cation of products in actual condition of mounting and operating environment before commercial shipment of the equipment. all electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for av, of?ce automation, household, of?ce supply, information service, telecommunications, (such as mobile phone or pc) etc.). before incorporating the components or devices into any equipment in the ?eld such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct in?uence to harm or injure a human body, please contact taiyo yuden co., ltd. for more detail in advance. do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. in addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a suf?cient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. the contents of this catalog are applicable to the products which are purchased from our sales of?ces or distributors (so called ? taiyo yuden ? s of?cial sales channel ? ). it is only applicable to the products purchased from any of taiyo yuden ? s of?cial sales channel. please note that taiyo yuden co., ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. taiyo yuden co., ltd. grants no license for such rights. caution for export certain items in this catalog may require specific procedures for export according to ? foreign exchange and foreign trade control law ? of japan, ? u.s. export administration regulations ? , and other applicable regulations. should you have any question or inquiry on this matter, please contact our sales staff. should you have any question or inquiry on this matter, please contact our sales staff.
;my applications ??y features goyordering code 60 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. f 178mm a?e?? 2mme?? a
k ? 10% m ? 20% z 80 20 % m
u
??? k ? 10% m ? 20% z 80 20 % a 4 j 6.3 l 10 e 16 t 25 g 35 u 50 k y?? ? `
u
??????? ? ?p% ~ class 2 standard multilayer ceramic capacitors (class2 :high dielectric constant type) y 1 ?y vdc 3 z??? 5 7 0??0) a j x?7 9 6 ? ?
i?0? pf 4 y
go eia l w mm 042(01005) 0.40.2 063(0201) 0.60.3 105(0402) 1.00.5 2 3??? 10 ptgg? 11 a 4 j 6.3 l 10 e 16 t 25 g 35 u 50 k plated 1 rated voltage vdc 3 end terminationy 5 7 capacitance tolerance standard products y 9 6 nominal capacitance pf 4 dimensions (case size) lw mm 2 10 11 ~ `??;+; ~ ?;+; 3?zphsz??? etc. ~ ?
sw2 u
$??b ~ t?3??w?wh?z ?t
qu?m ~ ? yz
i?0? c?u?m ? 102 1000 223 22000 a j ~ general electronic equipment ~ communication equipment (cellular phone, phs, other wireless applica- tions, etc.) ~ impr ove higher mounting densities. ~ multilayer block structur e provides higher reliability ~ a wide range of capacitance values available in standard case sizes. example 102 1000 223 22000 internal code standard products 042(01005) 0.40.2 063(0201) 0.60.3 105(0402) 1.00.5 1blank space 8
a ?? mm c 0.2 p 0.3 v 0.5 8 thickness mm c 0.2 p 0.3 v 0.5 1?? special code _ f 11 10 8 9 7 6 5 4 1 2 3 l m k 1 0 5 b j 1 0 4 k v code temp.characteristics operating temp. range operating temp. bj b 25 ? 8 5? x 5 r* 55 ? 85 ? b 7 x 7 r 55 ? 125 ? f f 25 ? 8 5? y 5 v 30 ? 85 ? * x?7w |`t??zx7r/x7s ?7t0 `om? ?uk??b{ * we may provide x 7r/x7 s for some items according to the individual speci?cation. 9s?
q bj b x 5 r b 7 x 7 r f f y 5 v 1?? temperature characteristics code bj b x 5 r b 7 x 7 r f f y 5 v 1 blank space m multilayer ceramic capacitor series name f 178 mm taping ( 2mm pitch) packagingy
capacitors ?
goyexternal dimensions 4 61 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. p. 62 p. 98 p. 102 p. 108 p. 12 ?t??3??y available capacitance range type eia l w t e ?mk042 0.4?0.02 0.2?0.02 0.2?0.02 c 0 .1 ? 0.03 01005 0.016?0.001 0.008?0.001 0.008?0.001 0.004?0.001 ?mk063 0.6?0.03 0.3?0.03 0.3?0.03 p 0.15 ? 0.05 0201 0.024?0.001 0.012?0.001 0.012?0.001 0.006?0.002 ?mk105 1.0?0.05 ?1 0.5?0.05 ?1 0.5?0.05 ?1 v 0.25 ? 0.10 0402 0.039?0.002 0.020?0.002 0.020?0.002 0.010?0.004 unitmm inch ??aa part numbers ?
q
$ electrical characteristics a packaging ?t
q reliability data ?; w?? pr ecautions ?3???? selection guide etc z;
u
??????? general multilayer ceramic capacitors temp.char. vdc cap | pf | pf 3digits type 100 150 220 330 470 680 1000 150 0 2 20 0 3 30 0 4 70 0 6 80 0 10000 15000 22000 33000 47000 68000 1 0 00 00 220000 470000 1000000 2200000 3300000 4700000 1 0 1 1 5 1 221 331 471 681 102 152 222 332 472 682 103 153 223 333 473 683 104 224 474 330000 334 105 225 335 475 063 042 105 x5r b/x5r b/x5r b/x7r b/x5r x5r f/y5v 25v 16v 6.3v 4v 10v 10v 6.3v10v 50v 25v 25v 16v 16v 10v 10v6.3v 6.3v 4v 50v 2 5v 16v 10v 6.3v v v 50v v v v v 35v v v v v v v v v v p c p c p p p p p p p v v v v v ?????? * e $s??gl`om?b{ ?ix??aa?? xi^m{ * the ?gure indicate typical value. please refer to part numbers table. ?:???wg?x
a ??g?pb{ note : letters in the table indicate thickness. ?: ?1 ?0.1mm ?)k? note: ?1. inclulding dimension tolerance?0.1mm 9s?
q ?? temp.char.code 9s?
q temperature characteristics
i?0??0) ? capacitance tolerance tan % dissipation factor j?f applicable standard 9s c? ? temperature range , j9s ? ref. temp.
i?0?!=p ? capacitance change b/bj jis b 25 ? 85 20 ? 1 0 ? 10 k ? 20 m 2 . 5 max.* eia x 5 r 55 ? 85 25 ? 15 b 7 eia x 7 r 55 ? 125 25 ? 15 f jis f 25 ? 8 5 20 3 0 / 80 80 y 20 z 7 . 0 max.* eia y 5 v 30 ? 85 25 22 / 82
62 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. ??aay part numbers 042 type 01005 case size 2 9s?
q temp.char.y bj:b/x 5 r 3 ?y rated voltage yy ordering code ehs environmental hazardous substances ?yy ?
i?0? capacitance pf 9s?
q temperature characteristics tan dissipation factor % max. ?
e soldering method r: ??? re?ow soldering w: ?? wave soldering
i?0? ? 0 ) capacitance tolerance ? thickness mm inch 10 v lmk 042 bj 101 ? c rohs 100 b/x 5 r * 2 5 r ? 10 % ? 20 % 0 . 2 ? 0 . 02 0 . 008 ? 0 . 001 lmk 042 bj 151 ? c rohs 150 lmk 042 bj 221 ? c rohs 220 lmk 042 bj 331 ? c rohs 330 lmk 042 bj 471 ? c rohs 470 lmk 042 bj 681 ? c rohs 680 lmk 042 bj 102 ? c rohs 1000 6 . 3v jmk 042 bj 152 ? c * 1 rohs 1500 10 jmk 042 bj 222 ? c * 1 rohs 2200 jmk 042 bj 332 ? c * 1 rohs 3300 jmk 042 bj 472 ? c * 1 rohs 4700 jmk 042 bj 682 ? c * 1 rohs 6800 jmk 042 bj 103 ? c * 1 rohs 10000 063 type 0201 case size 2 9s?
q temp.char.y bj:b/x 5 r 3 ?y rated voltage yy ordering code ehs environmental hazardous substances ?yy ?
i?0? capacitance pf 9s?
q temperature characteristics tan dissipation factor % max. ?
e soldering method r: ??? re?ow soldering w: ?? wave soldering
i?0? ? 0 ) capacitance tolerance ? thickness mm inch 25 v tmk 063 bj 101 ? p rohs 100 b/x 5 r * 2 3 . 5 r ? 10 % ? 20 % 0 . 3 ? 0 . 03 0 . 012 ? 0 . 001 tmk 063 bj 151 ? p rohs 150 tmk 063 bj 221 ? p rohs 220 tmk 063 bj 331 ? p rohs 330 tmk 063 bj 471 ? p rohs 470 tmk 063 bj 681 ? p rohs 680 tmk 063 bj 102 ? p rohs 1000 16 v emk 063 bj 152 ? p rohs 1500 5 emk 063 bj 222 ? p rohs 2200 emk 063 bj 332 ? p rohs 3300 10 v lmk 063 bj 472 ? p rohs 4700 lmk 063 bj 682 ? p rohs 6800 lmk 063 bj 103 ? p rohs 10000 lmk 063 bj 223 ? p * 1 rohs 22000 7 . 5 lmk 063 bj 473 ? p * 1 rohs 47000 x 5 r 7 . 5 lmk 063 bj 104 ? p * 1 rohs 100000 10 6 . 3v jmk 063 bj 473 ? p * 1 rohs 47000 7 . 5 jmk 063 bj 104 ? p * 1 rohs 100000 10 jmk 063 bj 224 mp * 1 , * 3 rohs 220000 ? 20 % 4 v amk 063 bj 224 mp * 1 rohs 220000 amk 063 bj 334 mp * 1 , * 3 rohs 330000 amk 063 bj 474 mp * 1 , * 3 rohs 470000 w?tx
i?0??0)g?u???b{ *1 ?9 ?y?gw?g?yx?yw 1.5 * 2 x?7 w | `t?? zx 7 r/x 7 s ?7 t 0 `om? ? uk??b { ? please specify the capacitance tolerance code. *1 test voltage of loading at high temperature test is 1.5 time of the rated voltage. *2 w e may provide x 7 r/x 7 s for some items according to the individual speci? cation. ? please specify the capacitance tolerance code. *1 test voltage of loading at high temperature test is 1.5 time of the rated volt- age. *2 we may provide x 7 r for some items according to the individual speci?cation. *3 the exchange of individual speci?cation is necessary depending on the ap- plication and circuit condition. please contact taiyo yuden sales channel. w?tx
i?0??0)g?u???b{ *1 ?9 ?y?gw?g?yx?yw 1.5 * 2 x?7 w | `t?? zx 7 r ?7 t 0 `om? ? uk??b { * 3 ] ?; w s? ? ;+ t?? z x?7 w ? | ?`u ?a ts??b { ? c
yf b ????ts e m ?dxi^m {
capacitors 4 63 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. ??aay part numbers 105 type 0402 case size 2 9s?
q temp.char.y bj:b/x 5 r 3 ?y rated voltage yy ordering code ehs environmental hazardous substances ?yy ?
i?0? capacitance pf 9s?
q temperature characteristics tan dissipation factor % max. ?
e soldering method r: ??? re?ow soldering w: ?? wave soldering
i?0? ? 0 ) capacitance tolerance ? thickness mm inch 50 v umk 105 bj 221 ? v rohs 220 b/x 5 r * 2 2 . 5 r ? 10 % ? 20 % 0 . 5 ? 0 . 05 0 . 02 ? 0 . 002 umk 105 bj 331 ? v rohs 330 umk 105 bj 471 ? v rohs 470 umk 105 bj 681 ? v rohs 680 umk 105 bj 102 ? v rohs 1000 umk 105 bj 152 ? v rohs 1500 umk 105 bj 222 ? v rohs 2200 umk 105 bj 332 ? v rohs 3300 umk 105 bj 472 ? v rohs 4700 umk 105 bj 682 ? v * 1 rohs 6800 umk 105 bj 103 ? v rohs 10000 3 . 5 35 v gmk 105 bj 104 ? v * 1 rohs 100000 b/x 5 r 5 25 v tmk 105 bj 682 ? v rohs 6800 b/x 5 r * 2 2 . 5 tmk 105 bj 103 ? v rohs 10000 3 . 5 tmk 105 bj 153 ? v rohs 15000 tmk 105 bj 223 ? v rohs 22000 tmk 105 bj 333 ? v * 1 rohs 33000 tmk 105 bj 473 ? v * 1 rohs 47000 tmk 105 bj 104 ? v * 1 rohs 100000 b/x 5 r 5 16 v emk 105 bj 333 ? v rohs 33000 b/x 5 r * 2 3 . 5 emk 105 bj 473 ? v rohs 47000 emk 105 bj 683 ? v rohs 68000 b/x 5 r 5 emk 105 bj 104 ? v * 1 rohs 100000 b/x 5 r * 2 emk 105 bj 224 ? v * 1 rohs 220000 b/x 5 r 10 v lmk 105 bj 104 ? v rohs 100000 lmk 105 bj 224 ? v * 1 rohs 220000 lmk 105 bj 474 ? v * 1 rohs 470000 x 5 r 10 lmk 105 bj 105 ? v * 1 rohs 1000000 6 . 3v jmk 105 bj 224 ? v * 1 rohs 220000 b/x 5 r 5 jmk 105 bj 474 ? v * 1 rohs 470000 x 5 r 10 jmk 105 bj 105 ? v * 1 rohs 1000000 jmk 105 bj 225 mv * 1 , * 3 rohs 2200000 ? 20 % 4 v amk 105 bj 335 mv * 1 , * 3 rohs 3300000 amk 105 bj 475 mv * 1 , * 3 rohs 4700000 0 . 5 ? 0 . 1 0 . 02 ? 0 . 004 ? please specify the capacitance tolerance code. *1 test voltage of loading at high temperature test is 1.5 time of the rated volt- age. *2 we may provide x 7 r for some items according to the individual speci?cation. *3 the exchange of individual speci?cation is necessary depending on the ap- plication and circuit condition. please contact taiyo yuden sales channel. w?tx
i?0??0)g?u???b{ *1 ?9 ?y?gw?g?yx?yw 1.5 * 2 x?7 w | `t?? zx 7 r ?7 t 0 `om? ? uk??b { * 3 ] ?; w s? ? ;+ t?? z x?7 w ? | ?`u ?a ts??b { ? c
yf b ????ts e m ?dxi^m {
64 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. 2 9s?
q temp.char.y f:y 5 v 3 ?y rated voltage yy ordering code ehs environmental hazardous substances ?yy ?
i?0? capacitance pf 9s?
q temperature characteristics tan dissipation factor % max. ?
e soldering method r: ??? re?ow soldering w: ?? wave soldering
i?0? ? 0 ) capacitance tolerance ? thickness mm inch 50 v umk 105 f 103 zv rohs 10000 f/y 5 v 5 r 80 ? ? 20 % 0 . 5 ? 0 . 05 0 . 02 ? 0 . 002 25 v tmk 105 f 223 zv rohs 22000 16 v emk 105 f 473 zv rohs 47000 7 emk 10 5 f 104 zv rohs 100000 9 10 v lm k 105 f 224 zv rohs 220000 11 6 . 3v jmk 105 f 474 zv rohs 470000 12 . 5 jmk 105 f 105 zv * 1 rohs 1000000 20 *1 test voltage of loading at high temperature test is 1.5 time of the rated voltage. *1 ?9 ?y?gw?g?yx?yw 1.5 ??aay part numbers 2 9s?
q temp.char.yb 7 :x 7 r 3 ?y rated voltage yy ordering code ehs environmental hazardous substances ?yy ?
i?0? capacitance pf 9s?
q temperature characteristics tan dissipation factor % max. ?
e soldering method r: ??? re?ow soldering w: ?? wave soldering
i?0? ? 0 ) capacitance tolerance ? thickness mm inch 50 v umk 105 b 7 221 ? v rohs 220 x 7 r 2 . 5 r ? 10 % ? 20 % 0 . 5 ? 0 . 05 0 . 02 ? 0 . 002 umk 105 b 7 331 ? v rohs 330 umk 105 b 7 471 ? v rohs 470 umk 105 b 7 681 ? v rohs 680 umk 105 b 7 102 ? v rohs 1000 umk 105 b 7 152 ? v rohs 1500 umk 105 b 7 222 ? v rohs 2200 umk 105 b 7 332 ? v rohs 3300 umk 105 b 7 472 ? v * 1 rohs 4700 umk 105 b 7 682 ? v * 1 rohs 6800 umk 105 b 7 103 ? v * 1 rohs 10000 3 . 5 25 v tmk 105 b 7 472 ? v rohs 4700 2 . 5 tmk 105 b 7 682 ? v rohs 6800 tmk 105 b 7 103 ? v rohs 10000 3 . 5 tmk 105 b 7 153 ? v * 1 rohs 15000 tmk 105 b 7 223 ? v * 1 rohs 22000 tmk 105 b 7 333 ? v * 1 rohs 33000 tmk 105 b 7 473 ? v * 1 rohs 47000 16 v emk 105 b 7 153 ? v rohs 15000 emk 105 b 7 223 ? v rohs 22000 emk 105 b 7 333 ? v rohs 33000 emk 105 b 7 473 ? v rohs 47000 emk 105 b 7 104 ? v * 1 rohs 100000 5 ? please specify the capacitance tolerance code. *1 test voltage of loading at high temperature test is 1.5 time of the rated voltage. w?tx
i?0??0)g?u???b{ *1 ?9 ?y?gw?g?yx?yw 1.5
98 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. c 0.2 0.008 0.3 0.012 0.3 0.012 0.45 0.018 0.3 0.012 0.5 0.020 0.5 0.020 0.8 0.031 0.8 0.031 0.5 0.020 0.6 0.024 0.45 0.018 0.85 0.033 1.25 0.049 0.85 0.033 0.85 0.033 0.85 0.033 1.15 0.045 1.25 0.049 1.6 0.063 0.85 0.033 1.15 0.045 1.5 0.059 1.9 0.075 2.0max 0.079 2.5 0.098 2.5 0.098 a?e??ay taped packaging y p p p k v, w w ? mk063 0201 ? ? w k105 0204 2k096 0302 ? mk042 01005 ? mk105 0402 ? vk105 0402 mm inch code
a ?? thickness eia typ e ? ? ? ? ? ? 150 0 0 15000 10000 10000 10000 a j
:? standard quantity [ pcs ] a? paper ??a? embossed tape a b a k d g d d d f g l d f h n y m ? wk107 0306 ? mk107 0603 ? 2k110 0504 ? mk212 0805 ? wk212 0508 ? 4k212 0805 ? 2k212 0805 ? mk316 1206 ? mk325 1210 ? mk432 1812 ? ? 300 0 ? ? ? 3 000 2 000 2000 2000 500 500 ) , 1000 % ? v v 400 0 0.45 0.018 4000 k ? 400 0 4 000 ? 400 0 ? 4 00 0 ? 4 000 4 000 ? 400 0 4 000 4000 ? ? ? ? ? ? m ay packaging ?a?e??py taping material t?wk t?wk unitmm inch 105, 107, 212 ypx0 ?`?bwpsemd<^m{ please contact any of our of?ces for accepting your requirement accord- ing to dimensions 0402, 0603 , 0805.(inch) ?????ybulk cassette ?7 ? !?o?
: minimum quantity t-????xz y??a?`{
capacitors 4 99 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. ay packaging ?a?e??
goy taping dimensionsy ya?y paper tape 8mm ? 0.315inches wide 2.0 ? 0.05 2.0 ? 0.05 t1 ? ?
?@ unitmm inch unitmm inch type ??
? ?
? e?? a?? eia chip cavity insertion pitch tape thickness a b f k t 3.7 4.9 8 . 0? 0.1 0.6max. ?mk432 1812 0. 146 0.193 0.315?0.004 4.0max. 0.024max. 0.157max. ??a?yembossed tape 8mm ? 0.315inches wide unitmm inch ??a?yembossed tape 12mm ? 0.472inches wide type ??
? ?
?e?? a?? eia chip cavity insertion pitch tape thickness a b f t ? mk 107 0603 1 . 0 1 . 8 4 . 0 ? 0 . 1 1 . 1 max. ? w k 10 7 0306 0 . 039 0 . 071 0 . 157 ? 0 . 004 0 . 043 max. ? 2 k 110 0504 1 . 15 1 . 55 4 . 0 ? 0 . 1 1 . 0 max. 0 . 045 0 . 061 0 . 157 ? 0 . 004 0 . 039 max. ? mk 212 0805 ? wk 21 2 0508 1 . 65 5 2 . 4 ? 4 k 212 0805 0 . 065 0 . 094 4 . 0 ? 0 . 1 1 . 1 max. ? 2 k 212 0805 0 . 157 ? 0 . 004 0 . 043 max. ? mk 316 1206 2 . 0 3 . 6 0 . 079 0 . 142 unitmm inch type ??
? ?
?e?? a?? eia chip cavity insertion pitch tape thickness a b f t ? 2 k 096 0302 0 . 72 1 . 02 5 2 . 0 ? 0 . 0 5 0 . 45 max.( 0 . 018 max) 0 . 028 0 . 040 0 . 079 ? 0 . 002 0 . 6 max.( 0 . 024 max) ? mk 105 0402 0 . 65 5 1 . 15 5 5 2 . 0 ? 0 . 05 0 . 8 max . ? vk 105 0402 0 . 026 0 . 045 0 . 079 ? 0 . 002 0 . 031 max. 2.0 ? 0.05 2.0 ? 0.05 ? ?
?@ type ??
? ?
?e?? a?? eia chip cavity insertion pitch tape thickness a b f k t ?wk107 0306 1.0 1.8 1.3max. 0.25?0.1 0.039 0.071 0.051max. 0.01?0.004 ?mk212 0805 1.655 2.4 0.065 0.094 4.0?0.1 ?mk316 1206 2.0 3.6 0.157?0.004 3.4max. 0.6max. 0.079 0.142 0.134max. 0.024max. ?mk325 1210 2.8 3.6 0.110 0.142 type ??
? ? chip cavity
? e?? insertion pitch a? ? tape thickness ) t 1 ? mk 042 01005 0 . 25 0 . 010 0 . 45 0 . 018 2 . 0 ? 0 . 05 0 . 079 ? 0 . 002 0 . 36 max. 0 . 014 0 . 27 max. 0 . 011 ? mk 063 0201 0 . 37 0 . 016 0 . 67 0 . 027 2 . 0 ? 0 . 05 0 . 079 ? 0 . 002 0 . 45 max. 0 . 018 0 . 42 max. 0 . 017 ? wk 105 0204 0 . 65 0 . 026 1 . 15 0 . 045 2 . 0 ? 0 . 05 0 . 079 ? 0 . 002 0 . 45 max 0 . 018 max 0 . 42 max 0 . 017 max unitmm inch
100 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. ????? ?? ?yleader and blank portiony 160mm? 6.3inches or more ?v z`m2 direction of tape feed 100mm? 3.94inches or more 400mm? 15.7inches or more ????
goyreel sizey ???a?sy top tape strengthy ??a?wxu`?x<
$1m2to0.1?0.7nqs??b{ the top tape requires a peel-off force of 0.1?0.7 n in the direction of the arrow as illustrated below. ay packaging
capacitors 4 103 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. bj: ?10%, ?20% f % bj: 2.5% max. 50 v, 25v f: 5.0% max. 50 v, 25v note 4 bj?10? 25?85? f ? 25?85? bj x7r ?15? f y5v yy? reliability data 1/3 item temperature compensating class 1 standard speci?ed value test methods and remarks high permitivity class 2 high value standard note 1 55 to 125? 55 to 125? 50vdc,25vdc, 16vdc n o b r e a k d o w n o r damage 10000 m
min. 0 .5 to 5 pf: ?0.25 pf 1 to 10pf: ?0.5 pf 5 to 10 pf: ?1 pf 11 pf or over: ? 5% ?10% 105 typer , s , t , u only 0.5?2pf : ? 0.1pf 2.2?20pf : ? 5 % under 30 pf : q?400 20c 30 pf or over : q ? 1000 c= nominal capacitance ck0?250 cj0?120 ch0?60 cg0?30 rh220?60 sk330?250 sj330?120 sh330?60 tk470?250 tj470?120 uk750?250 uj750?120 s l 350 t o ? 1000 ppm/ ? appearance: no abnormality capacitance change: within ?5% or ?0.5 pf, whichever is larger. bj55 to 125? f25 to 85? bj55 to 125? f25 to 85? 50vdc,25vdc 25 to 85? 25 to 85? 50 vdc, 35 vdc, 25 vdc 16vdc,10vdc,6.3vdc 4dvc, 2 . 5 vdc 16vdc 50vdc no abnormality no br eakdown or damage 500 m
f. or 10000 m
., whichever is the smaller. note 5 0.5 to 2 pf : ?0.1 pf 2.2 to 5.1 pf : ?5% r e f e r t o d e t a i l e d speci?cation ch0?60 rh220?60 ppm/? appearance: no abnormality capa citance change: within?0.5 pf appearance: no abnormality capacitance change: bjwithin ? 12.5% fwithin ?30% high frequency type 1 .operating temperature range 2 . s t o r a g e te m p e r a t u r e range 3 .rated voltage 4.withstanding v oltage between terminals 5.insulation resistance 6.capacitance t olerance 7. q or tangent of loss angle tan 8 .temperature characteristic of capacitance 9 .resistance to flexure of substrate without voltage ap- plication multilayer ceramic capacitor chips bj?10?z?20? f20??80? bj2.5? max. f7? max. note 4 bj?10? y 25?85? f30??80? y 25?85? bj x7rzx5r yy?15? f y5v yy22??82? 80 20 30 80 according to jis c 5102 clause 7.12. temperature compensating: measurement of capacitance at 20? and 85? shall be made to calculate temperature characteristic by the fol- lowing equation. c 85 ? c 20 10 6 y ppm/? c 20 t high permitivity: cha n ge of maximum capacitance deviation in step 1 to 5 temperature at step 1: 20? temperature at step 2 : minimum operating temperature temperature at step 3: 20? reference temperature temperature at step 4 : maximum operating temperature temperature at step 5: 20? reference temperature for x 7 r, x 5 r, y 5 u and y 5 v shall be 25 ? high capacitance type bj x 7 r 55 ? 125 ? , bj x 5 r 55 ? 85 ? e y 5 u 30 ? 85 ? , f y 5 v 30 ? 85 ? high capacitance type bj x 7 r 55 ? 125 ? , bj x 5 r 55 ? 85 ? e y 5 u 30 ? 8 5 ? , f y 5 v 30 ? 85 ? 22 82 warp: 1mm testing board: glass epoxy ? resin substrate thickness: 1.6mm 063 type : 0.8mm the measurement shall be made with board in the bent position. applied voltage: rated voltage3 class 1 rated voltage2.5 class 2 duration: 1 to 5 sec. charge/discharge current: 50ma max. class 1,2 applied voltage: rated voltage duration: 60? 5 sec. charge/discharge current: 50ma max. measuring frequency class1 1"hz?10% c?1000pf 1:hz?10% c?1000pf class2 1:hz?10% c?10f 120hz?10hz c?10f measuring voltage note 4 class10.5?5 vrms c?1000pf 1?0.2 vrms c?1000pf class2 1?0.2 vrms c?10f 0.5?0.1 vrms c?10f bias application: none multilayer: measuring fr equency class 1 1"hz?10% c?1000pf 1:hz?10% c?1000pf class2 1:hz?10% c?10f 120hz?10hz c?10f measuring voltage note 4yyyy class10.5?5 vrms c?1000pf 1?0.2 vrms c?1000pf class2 1?0.2 vrms c?10f 0.5?0.1 vrms c?10f bias application: none high ?fr equency ?multilayer: measuring frequency: 1ghz measuring equipment: hp4291a measuring jig: hp16192a
capacitors 4 105 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. reliability data 2/3 10 .body strength 11 .adhesion of electrode 12.solderability 13.resistance to soldering 14.thermal shock 15 . damp heat steady state no mechanical dam- age. appearance: no ab- normality capa citance change: within ?2.5% q: initial value insu lation resistance: initial value with standing voltage between terminals : no abnormality appe arance: no ab- normality cap a citance change: within ?0.25pf q: initial value insu lation resistance: initial value with standing voltage between terminals : no abnormality appe arance: no ab- normality cap a citance change: within ?0.5 pf, insulation resistance: 1000 m
min. appearance: no abnormality capacitance change: within ?7 . 5% bj within ?20% f tan : initial value note 4 insulation resistance: initial value withstanding voltage between terminals : no abnormality appearance: no abnormality capacitance change: within ?7 . 5% bj within ?20% f tan : initial value note 4 insulation resistance: initial value withstanding voltage between terminals : no abnormality appearance: no ab- normality capa citance change: w i t h i n ? 2 . 5 % o r ?0.25 pf, whichever is larger. q: initial value ins u lation resistance: initial value with standing voltage between terminals : no abnormality appe arance: no ab- normality capa citance change: w i t h i n ? 2 . 5 % o r ?0.25 pf, whichever is larger. q: initial value ins u lation resistance: initial value with standing voltage between terminals : no abnormality appe arance: no ab- normality capa citance change: within ? 5 % or ? 0 . 5 pf, whichever is larger. q: c ?30 pf : q ?350 10 ? c ? 30 p f : q ? 275 2.5c c?10 pf : q?200 10c c: nominal capacitance insulation resistance: 1000 m
min. no separation or indication of separation of electrode. at least 95 % of terminal electrode is covered by new solder. appearance: no ab- normality capacitance change: bj: within ?12. 5% f: within ?30% tan : bj: 5.0% max. f: 7.5% max. note 4 insulation resistance: 50 m
f or 1000 m
whichever is smaller. note 5 appearance: no ab- normality cap a citance change: bj:within ?12.5% note 4 tan : bj: 5.0% max. note 4. f: 11.0% max. insulation resistance: 50 m
f or 1000 m
whichever is smaller. note 5 high frequency multilayer: applied force: 5n duration: 10 sec. applied force: 5n duration: 30?5 sec. solder temperature: 230?5? duration: 4?1 sec. preconditioning: thermal treatment at 150? for 1 hr applicable to class 2. solder temperature: 270?5? duration: 3?0.5 sec. preheating conditions: 80 to 100 ? , 2 to 5 min. or 5 to 10 min. 150 to 200 ? , 2 to 5 min. or 5 to 10 min. recovery: recovery for the following period under the standard condition after the test. 6?24 hrs class 1 24?2 hrs class 2 preconditioning: thermal treatment at 150? for 1 hr applicable to class 2. conditions for 1 cycle: step 1 : minimum operating temperature ? 30 ? 3 min. step 2 : room temperature 2 to 3 min. step 3 : maximum operating temperature ? 30 ? 3 min. step 4 : room temperature 2 to 3 min. number of cycles: 5 times recovery after the test: 6?24 hrs class 1 24?2 hrs class 2 item temperature compensating class 1 standard test methods and remarks high permittivity class 2 high value standard note 1 high frequency type speci?ed value a a a lw reverse multilayer preconditioning: thermal treatment at 150? for 1 hr applicable to class 2. temperature: 40?2? humidity: 90 to 95% rh duration: 500 hrs recovery: recovery for the following period under the standard condition after the removal from test chamber. 6?24 hrs class 1 24?2 hrs class 2 high? frequency multilayer: temperature: 60?2? humidity: 90 to 95% rh duration: 500 hrs recovery: recovery for the following period under the standard condition after the removal from test chamber. 6?24 hrs class 1 multilayer ceramic capacitor chips 24 0 24 0 0 3 0 3 01005, 0201, 0302 type 2n
capacitors 4 107 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. reliability data 3/3 according to jis c 5102 clause 9. 9. multilayer: preconditioning: voltage tr eatment class 2 temperature: 40?2? humidity: 90 to 95% rh duration: 500 hrs applied voltage: rated voltage char ge and discharge curr ent: 50ma max. class 1,2 recovery: recovery for the following period under the standard condition after the removal from test chamber. 6?24 hrs class 1 24?2 hrs class 2 high? frequency multilayer: temperature: 60?2? humidity: 90 to 95% rh duration: 500 hrs applied voltage: rated voltage char ge and discharge curr ent: 50ma max. recovery: 6?24 hrs of recovery under the standard condition after the removal from test chamber. according to jis c 5102 clause 9.10. multilayer: pr econditioning: voltage tr eatment class 2 temperature: 125?3?class 1, class 2: b, bj x7r 85?2? class 2: bj,f duration: 1000 hrs applied voltage: rated voltage2 note 6 recovery: recovery for the following period under the standard condition after the removal from test chamber. yyy6?24 hrs class 1 yyy 24?2 hrs class 2 high? frequency multilayer: temperature: 125?3? class 1 duration: 1000 hrs applied voltage: rated voltage2 recovery: 6?24 hrs of recovery under the standard condition after the removal from test chamber. 16 .loading under damp heat 17. loading at high tempera- ture appearance: no ab- normality capacitance change: c ? 2 pf: within ? 0 . 4 pf c ? 2 pf: within ? 0 . 75 pf c no m inal capaci- tance ins u lation resistance: 500 m
min. appearance: no ab- normality capacitance change: within ?3 % or ? 0.3 pf, whichever is larger. insulation resistance: 1000 m
min. appearance: no ab- normality c ap a citance change: within ? 7 . 5 % or ? 0.75 pf, whichever is larger. q: c?30 pf: q?200 c ? 30 pf: q ? 100 10c/3 c nominal capaci- tance i nsu lation resistance: 500 m
min. appearance: no ab- normality capacitance change: within ?3 % or ? 0.3 pf, whichever is larger. q: c?30 pf : q?350 10 ? c ? 30 pf: q ? 275 2.5c c?10 pf: q?200 10c c nominal capacitance insulation r esistance: 1000 m
min. appearance: no ab- normality c apa citance change: bjwithin?12.5? fwithin?30? note 4 tan bj5.0?max. f11?max. note 4 insulation resistance: 25 m
f or 500 m
, whichever is the smaller. note 5 appearance: no abnormality capacitance change: bjwithin?12.5? within?20?tt within?25?tt fwithin?30? note 4 tan bj5.0?max. f11?max.y note 4 insulation resistance: 50 m
f or 1000 m
, whichever is smaller. note 5 appearance: no ab- normality capacitance change: bj: within ?12 . 5% f: within ?30% note 4 tan : bj: 5.0% max. f: 7.5% max. note 4 insulation resistance: 25 m
f or 500 m
, whichever is the smaller. note 5 appearance: no ab- normality capacitance change: bj: within ?12 . 5% f: within ?30% note 4 tan : bj: 4.0% max. f: 7.5% max. note 4 insulation resistance: 50 m
f or 1000 m
, whichever is smaller. note 5 item t emperature compensating class 1 standard speci?ed value test methods and remarks high permittivity class 2 high value standard note 1 high frequency type 24 0 24 0 48 0 48 0 multilayer ceramic capacitor chips note 1 :for 105 type, speci?ed in "high value". note 2 :thermal treatment multilayer : 1 hr of thermal treatment at 150 0 / 10 ? followed by 24 ? 2 hrs of recovery under the standard condition shall be performed before the measurement. note 3 : voltage treatment multilayer : 1 hr of voltage treatment under the speci?ed temperature and voltage for testing followed by 24 ? 2 hrs of recovery under the standard condition shall be performed before the measurement. note 4, 5 :the ?gure indicates typical inspection. please refer to individual speci?cations. note 6 :some of the parts are applicable in rated voltage1.5 . please refer to individual speci?cations. note on standard condition: "standard condition" referred to herein is de?ned as follows: 5 to 35? of temperature, 45 to 85 % relative humidity, and 86 to 106 kpa of air pressure. when there are questions concerning measurement results: in order to provide correlation data, the test shall be conducted under condition of 20?2? of temperature, 60 to 70 % relative humidity, and 86 to 106 kpa of air pressure. unless otherwise speci?ed, all the tests are conducted under the "standard condition."
precautions capacitors 4 109 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. 1/6 technical considerations stages precautions precautions on the use of multilayer ceramic capacitors 1 .circuit design veri?cation of operating environment, electrical rating and per- formance 1 . a m alfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social rami?cations. as such, any capacitors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. operating voltage veri?cation of rated voltage 1 . the operating voltage for capacitors must always be lower than their rated values. if an ac voltage is loaded on a dc voltage, the sum of the two peak voltages should be lower than the rated value of the capacitor chosen. for a circuit where both an ac and a pulse voltage may be present, the sum of their peak voltages should also be lower than the capacitor's rated voltage. 2 . even if the applied voltage is lower than the rated value, the reliability of capacitors might be reduced if either a high fre- quency ac voltage or a pulse voltage having rapid rise time is present in the circuit. 1 .the following diagrams and tables show some examples of recommended patterns to prevent excessive solder amourts. larger ?llets which extend above the component end terminations examples of improper pattern designs are also shown. 1 recommended land dimensions for a typical chip capacitor land patterns for pcbs 2.pcb design pattern con?gurations design of land-patterns 1 . when capacitors are mounted on a pcb, the amount of solder used size of ?llet can directly affect capacitor per- formance. therefore, the following items must be carefully considered in the design of solder land patterns: 1 the amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. therefore, when designing land-patterns it is necessary to consider the appropri- ate size and con?guration of the solder pads which in turn determines the amount of solder necessary to form the ?llets. 2 when more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by solder-resist. recommended land dimensions for wave-soldering unit: mm recommended land dimensions for re?ow-soldering unit: mm type 107 212 316 325 1.6 2.0 3.2 3.2 0.8 51.25 1 .6 2 .5 a 0.8?1.0 1.0?1.4 1.8?2.5 1.8?2.5 b 0.5?0.8 0.8?1.5 0.8?1.7 0.8?1.7 c 0.6?0.8 0.9?1.2 1.2?1.6 1.8?2.5 l w excess solder can af fect the ability of chips to withstand mechanical stresses. there- fore, please take proper pr ecautions when designing land-patter ns. l w size l w type 212 2 circuits 110 2 circuits 096 2 circuits 2.0 1.37 0.9 1.25 1.0 0.6 a 0.5?0.6 0.35?0.45 0.25?0.35 b 0.5?0.6 0.55?0.65 0.15?0.25 c 0.5?0.6 0.3?0.4 0.15?0.25 d 1.0 0.64 0.45 type 042 063 105 107 212 316 325 432 0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5 0.2 0.3 0.5 0.8 51.25 1 .6 2 .5 3.2 a 0.15?0.25 0.20?0.30 0.45?0.55 0.8?1.0 0.8?1.2 1.8?2.5 1.8?2.5 2.5?3.5 b 0.10?0.20 0.20?0.30 0.40?0.50 0.6?0.8 0.8?1.2 1.0?1.5 1.0?1.5 1.5?1.8 c 0.15?0.30 0.25?0.40 0.45?0.55 0.6?0.8 0.9?1.6 1.2?2.0 1.8?3.2 2.3?3.5 size l w type 212 4 circuits 2.0 1.25 a 0.5?0.6 b 0.5?0.6 c 0.2?0.3 d 0.5 size size
precautions capacitors 4 111 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. size 2/6 2 examples of good and bad solder application 2.pcb design 1 - 1 . the following are examples of good and bad capacitor layout; smd capacitors should be located to minimize any possible mechanical stresses from board warp or de?ection. not recommended recommended de?ection of the board pattern con?gurations capacitor layout on panelized [br eakaway] pc boards 1 . after capacitors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes pcb cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the re?ow soldered boards etc. for this reason, planning pattern con?gurations and the position of smd ca- pac i tors should be carefully performed to minimize stress. items component plac ement close to the chassis not recommended recommended 1-2 . to layout the capacitors for the breakaway pc board, it should be noted that the amount of mechanical stresses given will vary depending on capacitor layout. the example below shows recommendations for better design. 1 - 3 . when breaking pc boards along their perforations, the amount of mechanical stress on the capacitors can vary according to the method used. the following methods are listed in order from least stressful to most stressful: push-back, slit, v-grooving, and perforation. thus, any ideal smd capacitor layout must also consider the pcb splitting procedure. technical considerations stages precautions mixed mounting of smd and leaded compo- nents hand-soldering of leaded components near mounted components horizontal component placement precautions on the use of multilayer ceramic capacitors lwdc recommended land dimensions for re?ow-soldering unit: mm l w type 105 107 212 0.52 50.8 1.25 1 .0 1.6 2.0 a 0.18?0.22 0.25?0.3 0.5?0.7 b 0.2?0.25 0.3?0.4 0.4?0.5 c 0.9?1.1 1.5?1.7 1.9?2.1
precautions capacitors 4 113 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. 3/6 3 .considerations for auto- matic placement adjustment of mounting machine 1 . excessive impact load should not be imposed on the ca- pacitors when mounting onto the pc boards. 2 . the maintenance and inspection of the mounters should be conducted periodically. technical considerations stages precautions 1 . if the lower limit of the pick-up nozzle is low, too much force may be imposed on the capacitors, causing damage. to avoid this, the following points should be considered before lowering the pick-up nozzle: 1 the lower limit of the pick-up nozzle should be adjusted to the surface level of the pc board after correcting for de?ection of the board. 2 the pick-up pressure should be adjusted between 1 and 3 n static loads. 3 to reduce the amount of de?ection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the pc board. the fol- lowing diagrams show some typical examples of good pick-up nozzle placement: not recommended recommended single-sided mounting double-sided mounting 2 . as the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the capacitors because of mechanical impact on the capacitors. to avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. 1 . some adhesives may cause reduced insulation resistance. the difference between the shrinkage percentage of the adhesive and that of the capacitors may result in stresses on the capacitors and lead to cracking. moreover, too little or too much adhesive applied to the board may adversely affect component placement, so the fol- lowing precautions should be noted in the application of adhesives. 1 requir ed adhesive characteristics a. the adhesive should be strong enough to hold parts on the board during the mount- ing & solder process. b. the adhesive should have suf?cient strength at high temperatur es. c. the adhesive should have good coating and thickness consist ency. d. the adhesive should be used during its prescribed shelf life. e. the adhesive should harden rapidly f. the adhesive must not be contaminated. g. the adhesive should have excellent insulation characteristics. h. the adhesive should not be toxic and have no emission of toxic gasses. 2 the recommended amount of adhesives is as follows; figure 212/316 case sizes as examples a 0.3mm min b 100 ?120 m c adhesives should not contact the pad selection of adhesives 1 . mounting capacitors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded capacitor characteristics unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. precautions on the use of multilayer ceramic capacitors
precautions capacitors 4 115 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. 4/6 4. soldering selection of flux 1 . since ?ux may have a signi?cant effect on the performance of capacitors, it is necessary to verify the following condi- tions prior to use; 1 flux used should be with less than or equal to 0.1 wt% equivelent to chroline of halogenated content. flux having a strong acidity content should not be applied. 2 when soldering capacitors on the board, the amount of ?ux applied should be controlled at the optimum level. 3 when using water-soluble ?ux, special care should be taken to properly clean the boards. soldering temperature, time, amount of solder, etc. are speci?ed in ac- cordance with the following recommended conditions. sn-zn solder paste can affect mlcc r eliability performance. please contact us prior to usage. 1-1 . when too much halogenated substance chlorine, etc. content is used to activate the ?ux, or highly acidic ?ux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resis- tance on the surface of the capacitors. 1-2 . flux is used to increase solderability in ?ow soldering, but if too much is applied, a large amount of ?ux gas may be emitted and may detrimentally affect solderability. to minimize the amount of ?ux applied, it is recommended to use a ?ux-bubbling system. 1-3 . since the residue of water-soluble ?ux is easily dissolved by water content in the air, the residue on the surface of capacitors in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the compo- nents. the cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble ?ux. 1-1 . preheating when soldering heating: ceramic chip components should be preheated to within 100 to 130? of the soldering. coo l ing: the temperature difference between the components and cleaning process should not be greater than 100?. ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concen- trat ed heating or rapid cooling. therefore, the soldering process must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock. technical considerations stages precautions precautions on the use of multilayer ceramic capacitors recommended conditions for soldering [re?ow soldering] temperature pro?le 2 . because excessive dwell times can detrimentally affect solderability, soldering du- ration should be kept as close to recommended times as possible. [w ave soldering] temperature pro?le caution 1 . the ideal condition is to have solder mass ?llet controlled to 1/2 to 1/3 of the thickness of the capacitor, as shown below: capacitor pc board solder caution 1 . make sure the capacitors are preheated suf?ciently. 2 . the temperature difference between the capacitor and melted solder should not be greater than 100 to 130? 3. cooling after soldering should be as gradual as possible. 4 . wave soldering must not be applied to the capacitors designated as for re?ow sol- dering only. e?? 260 ??< 10 | e?? 260 ? ?< 10 | '?150? 60 ? 350 ??< 3 | 120 ? 60 ? '?150? ?c?230 ?? 40 | t?? qx?i9sqw)u 100 ? ??:x s|w- aqs??b { t?? qx?i9sqw)u ? ??:x s|w- aqs??b { t?? ??7??ax ?v?b{ t?)? 190? 3216 ? ???zu 1 ?* ??`?b{ ta
?u??t
? ??sm?ot]y?<^m{ ts
:x 1s| w- aqs??b { ? g9s????x7g?0 epk?z yy t\??
* ?b??wpx]_m?d?{ 9s? 300 200 100 0 9s? 300 200 100 0 9s? 400 300 200 100 0 ?? ?? ?? peak 260? max 10 sec max peak 260? max 10 sec max t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be reflow soldering for 2 times. t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be wave soldering for 1 time. t except for reflow soldering type. t?) ? 190? 3216t ype max , ?)? 130? 3225 t ype min t it is recommended to use 20w soldering iron and the tip is 1 or less. t the soldering iron should not directly touch the components. t assured to be soldering iron for 1 time. note: the above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. temperature ? 300 200 100 0 temperature ? 300 200 100 0 t emperature ? 400 300 200 100 0 preheating 150? 60 sec min gradually cooling gradually cooling gradually cooling heating above 230? 40 sec max preheating 150? 120 sec min 350? max 3 sec max 60 sec min ?) ?) pb free soldering pb free soldering pb free soldering e?? 260 ??< 10 | e?? 260 ? ?< 10 | '?150? 60 ? 350 ??< 3 | 120 ? 60 ? '?150? ?c?230 ?? 40 | t?? qx?i9sqw)u 100 ? ??:x s|w- aqs??b { t?? qx?i9sqw)u ? ??:x s|w- aqs??b { t?? ??7??ax ?v?b{ t?)? 190? 3216 ? ???zu 1 ?* ??`?b{ ta
?u??t
? ??sm?ot]y?<^m{ ts
:x 1s| w- aqs??b { ? g9s????x7g?0 epk?z yy t\??
* ?b??wpx]_m?d?{ 9s? 300 200 100 0 9s? 300 200 100 0 9s? 400 300 200 100 0 ?? ?? ?? peak 260? max 10 sec max peak 260? max 10 sec max t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be reflow soldering for 2 times. t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be wave soldering for 1 time. t except for reflow soldering type. t?) ? 190? 3216t ype max , ?)? 130? 3225 t ype min t it is recommended to use 20w soldering iron and the tip is 1 or less. t the soldering iron should not directly touch the components. t assured to be soldering iron for 1 time. note: the above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. temperature ? 300 200 100 0 temperature ? 300 200 100 0 t emperature ? 400 300 200 100 0 preheating 150? 60 sec min gradually cooling gradually cooling gradually cooling heating above 230? 40 sec max preheating 150? 120 sec min 350? max 3 sec max 60 sec min ?) ?) pb free soldering pb free soldering pb free soldering
precautions capacitors 4 117 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. 5/6 [hand soldering] y temperature pro?le 5.cleaning cleaning conditions 1 . wh en cleaning the pc board after the capacitors are all mounted, select the appropriate cleaning solution according to the type of ?ux used and purpose of the cleaning e.g. to remove soldering ?ux or other materials from the produc- tion process. 2 . cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the capacitor's characteristics. 1 . the use of inappropriate solutions can cause foreign substances such as ?ux residue to adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a degradation of the capacitor's electrical properties especially insulation resistance . 2 . inappropriate cleaning conditions insuf?cient or excessive cleaning may detrimen- tally affect the performance of the capacitors. 1 excessive cleaning in the case of ultrasonic cleaning, too much power output can cause excessive vibra- tion of the pc board which may lead to the cracking of the capacitor or the soldered portion, or decrease the terminal electrodes' strength. thus the following conditions should be carefully checked; ultrasonic output below 20 w/ y ultrasonic frequency below 40 khz ultrasonic washing period 5 min. or less 4. soldering 6 .post cleaning processes 1 . with some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hard- ening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance. 2 . when a resin's hardening temperature is higher than the capacitor's operating temperature, the stresses generated by the excess heat may lead to capacitor damage or destruction. the use of such resins, molding materials etc. is not recom- mended. breakaway pc boards splitting along perforations 1 . when splitting the pc board after mounting capacitors and other components, care is required so as not to give any stresses of de?ection or twisting to the board. 2 . board separation should not be done manually, but by us- ing the appropriate devices. mechanical considerations 1 . be car eful not to subject the capacitors to excessive me- chanical shocks. 1 if ceramic capacitors are dropped onto the ?oor or a hard surface, they should not be used. 2 when handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. 7.handling technical considerations stages precautions precautions on the use of multilayer ceramic capacitors caution 1. use a 20 w soldering iron with a maximum tip diameter of 1.0 mm. 2 . the soldering iron should not directly touch the capacitor. e?? 260 ??< 10 | e?? 260 ? ?< 10 | '?150? 60 ? 350 ??< 3 | 120 ? 60 ? '?150? ?c?230 ?? 40 | t?? qx?i9sqw)u 100 ? ??:x s|w- aqs??b { t?? qx?i9sqw)u ? ??:x s|w- aqs??b { t?? ??7??ax ?v?b{ t?)? 190? 3216 ? ???zu 1 ?* ??`?b{ ta
?u??t
? ??sm?ot]y?<^m{ ts
:x 1s| w- aqs??b { ? g9s????x7g?0 epk?z yy t\??
* ?b??wpx]_m?d?{ 9s? 300 200 100 0 9s? 300 200 100 0 9s? 400 300 200 100 0 ?? ?? ?? peak 260? max 10 sec max peak 260? max 10 sec max t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be reflow soldering for 2 times. t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be wave soldering for 1 time. t except for reflow soldering type. t?) ? 190? 3216t ype max , ?)? 130? 3225 t ype min t it is recommended to use 20w soldering iron and the tip is 1 or less. t the soldering iron should not directly touch the components. t assured to be soldering iron for 1 time. note: the above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. temperature ? 300 200 100 0 temperature ? 300 200 100 0 t emperature ? 400 300 200 100 0 preheating 150? 60 sec min gradually cooling gradually cooling gradually cooling heating above 230? 40 sec max preheating 150? 120 sec min 350? max 3 sec max 60 sec min ?) ?) pb free soldering pb free soldering pb free soldering
precautions capacitors 4 119 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. 6/6 8.storage conditions storage 1 . to maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. humidity should especially be kept as low as possible. ~ recommended conditions ambient temperature below 30? humidity below 70% rh the ambient temperature must be kept below 40? . even under ideal storage conditions capacitor electrode solder- ability decreases as time passes, so should be used within 6 months from the time of delivery. ~ ceramic chip capacitors should be kept where no chlorine or sulfur exists in the air. 2 . the capacitance value of high dielectric constant capacitors type 2 & 3 will gradually decrease with the passage of time, so this should be taken into consideration in the circuit design. if such a capacitance reduction occurs, a heat treatment of 150 ? for 1 hour will return the capacitance to its initial level. 1 . if the parts are stored in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and dete- rioration of taping/packaging materials may take place. for this reason, components should be used within 6 months from the time of delivery. if exceeding the above period, please check solderability before using the capacitors. technical considerations stages precautions precautions on the use of multilayer ceramic capacitors

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